Home
Company
Equipments
Service
Contact us
中文版


::Equipments::      Products can be RoHS Compliant

                    SGS Certificate:TJTC0709312/CHEM
SMT Lines

Chip Mounters:
Siemens   HS 50  F5  
Yamaha    YV180  YV88  
Dynapert  I-2000 I-318
Component:
Chip 0402 0603 0805 to SOT23
QFP  0.35mm pitch
BGA  0.8mm pitch
Component CCD Camera
Precision:
 Chip         0.1mm
 QFP and BGA  0.08mm 
　

Quality control
 
ESD environment
Statistical Process Control
On-line circuits testing
Total customer satisfaction
ISO 9001:2000 Quality system

Deliveery and packing

Packed in anti-static panel
Delivery time as required
Fast response to customer

Bonding Machines

ASM AB 520A AB509A
ITM BONDA 101 

Process
Rich experience on wire bonding
Manufacturer of Aluminum and Gold bonding wire